Wave soldering is a bulk soldering process used in the manufacture of printed circuit boards. The circuit board is passed over a pan of molten solder in which a pump produces an upwelling of solder that looks like a standing wave. We produce a series of high temperature resistant solder wave masking tapes which are capable of being used even in the very demanding conditions associated with lead-free soldering processes. These products can be supplied in roll form, standard dot sizes and special die-cut formats.
Printed Circuit Board (PCB) fabrication is the assembly method for circuit boards used in electronic and computer devices. The layers of the board are put together along with the specific surface pattern so it can be used in electronics manufacturing. Masking tape is to protect backside of the PCB multilayer during gold contacts processing.
PPI 701 High temperature-resistant polyimide masking tape for gold contacts on printed circuit boards during the wave soldering process.
PPI 702 Thicker adhesive version of PPI 701 with superior adhesion to uneven surfaces.
RD-042D / RD-624B Anti-static printed circuit board and conformal coating masking tape based on polyimide film coated with a special surface conductive adhesive. Widely used in the production of premium quality PCBs were static reduction is critical.
SP-255 / SP-479 Crepe paper based self-adhesive masking tape especially suitable for the protection of various areas of P.C. Boards (such as gold contacts) during high temperature flow solder processes. It is particularly recommended for masking edge connectors or fingers during hot air levelling.
RD-487G Masking tape for hot air levelling processes based on paper/polyester film coated with a heat resistant polysiloxane adhesive. RD-487G resists temperature up to 300°C short term and can be removed from the substrate without leaving any adhesive residue. The polyester reinforcement prevents tape tearing during removal. The tape is suitable for masking of gold fingers. RD-487G conforms to PCB irregularities and gives a fine masking line.
RD-673B Low tack protection tape for pre-lacquered printed circuit board substrates. Based on a flatback impregnated paper coated with a low tack, black opaque rubber adhesive. The tape can be applied and removed from a wide range of surfaces without adhesive transfer.